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XY SW200

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XY SW200

XY SW200
Manufacturer:

Xytronic
Price:

5,00 zł netto
6,15 zł brutto (23% VAT)

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Description
  • Made of oil-free and oxide-free copper wire with a very small diameter, it guarantees easy and accurate removal of tin solder. Coating the braid with a thin layer of rosin not only improves its absorption properties but also provides long-term protection of the wire surface from oxidation.
  • The original braid with a large working surface provides high absorption capacity of the braid and thus the removal of molten solder occurs quickly, protecting the components of the repaired circuit from overheating.
  • The braid is ideal for printed circuits with both SMD and traditional components, quickly and easily removing solder when disassembling components, cleaning components and boards, and eliminating solder bridges between printed paths.

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Despite our best efforts, we do not guarantee that the published technical data do not contain errors which can not, however, be the basis for claims.rnThe appearance of the instruments may slightly differ from those shown in the pictures.rnThese prices are informative and do not constitute a commercial offer within the meaning of Art.66 par.1 of the Civil Code.

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